BGA X-Ray Sample

X-ray inspection for BGA solder joint verification, QFN thermal-pad voiding, and any hidden-joint package where optical inspection cannot see the connection. Sample rates are agreed at NPI gate 2 — not applied indiscriminately to every board as a fake "100% X-ray" claim.

Reports include 2D slice images and void percentage per joint against IPC-7095 criteria. Class 3 programs can contract for 100% X-ray; Class 2 programs usually use a density-based sample plan that the buyer's QA desk can defend.

• Coverage: BGA, QFN, LGA, and PoP — all hidden-joint package families
• Sample rate: per package density, agreed at NPI gate 2 with the customer
• Report: 2D slice images, void percentage per joint, pass/fail per IPC-7095
• Trigger: 100% X-ray available for Class 3 programs on contract
• Handoff: AOI remains the workhorse for visible-lead packages — X-ray is not a substitute slogan