- Coverage
- SPI 100% · AOI pre/post-reflow by shift tier
- Shift model
- Proto / dual / 24×5 capacity packs
- NPI gate
- Gate 1 — DFM + pad/BOM match before stencil
Solution
SMT Line Capacity Pack
High-mix low-volume SMT lines with SPI/AOI coverage listed per shift model. Component range from 0201 to BGA with documented placement capability.
SMT line capacity is documented per shift model — not per theoretical maximum on a marketing slide. MixLine publishes SPI (solder paste inspection) and AOI (automated optical inspection) coverage rates by shift tier so buyers understand what inspection density their volume actually buys before the first paste deposit.
Placement programs cover industrial controllers, instrumentation boards, and mixed-technology panels where changeover discipline matters more than peak CPH. Process windows are logged per line and shared at first article — buyers see the profile, not only a pass/fail stamp.
- Placement: 0201 to 45 mm BGA, fine-pitch QFP and QFN with documented capability matrices
- SPI: 100% paste inspection on all shifts — coverage rate is non-negotiable
- AOI: before reflow standard on all shifts; post-reflow on production and volume tiers
- Shift models: proto (single shift), production (dual shift), volume (24×5)
- Traceability: feeder and lot IDs retained for the contracted retention window
Related capabilities
Box-Build Assembly
Cable harness + PCB + enclosure integration with in-house burn-in fixtures. IPC/WHMA workmanship standards applied.
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Conformal Coat Station
Selective conformal coating for harsh-environment electronics. IPC workmanship standards with mask-and-coat photos documented per program.
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ICT Fixture Program
Bed-of-nails ICT programs with fixture ownership clauses on contract. Test coverage report included at NPI gate.
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